邱浩，副教授，博士生导师，国家级青年人才。

2010年本科毕业于金沙威尼斯欢乐娱人城材料系，保送金沙威尼斯欢乐娱人城，于2013年获得硕士学位。之后赴东京大学攻读博士学位，师从Toshiro Hiramoto教授，期间获得日本学术振兴会（JSPS）资助，于2016年获得博士学位。毕业后加入Takayasu Sakurai教授（IEEE会士）与Makoto Takamiya教授课题组担任特聘研究员。2021年回国加入金沙威尼斯欢乐娱人城。

围绕超低功耗集成电路器件、可靠性、芯片架构开展研究，以第一/通讯作者在Nature Electron.、Nature Commun.、IEEE集成电路顶刊JSSC、IEDM、VLSI等期刊和会议上发表论文20余篇，2篇入选ESI高被引论文，他引超1800次，单篇最高近900次，入选爱思维尔中国高被引学者、华为“紫金学者”。申请/授权美国、日本专利6件。曾获日本十大创新科技奖、IEEE日本优秀学生奖、国家优秀自费留学生奖学金、江苏省科学技术一等奖（2016年，第六完成人）、江苏省优秀硕士学位论文、硕士研究生国家奖学金、本科生国家奖学金两次。

主持国家自然科学基金首批优秀青年（海外）项目、重点项目、面上项目、创新研究群体核心成员、参与科技部国家重点研发计划等项目。担任IEEE JSSC、TCAS-I、TVLSI、TMTT、TIE、TED、中国科学: 信息科学等国际高水平期刊审稿人。

课题组现在开放招收博士、硕士研究生，招聘专职科研人员和博士后，诚邀有志于共同探索集成电路的朋友加盟。

1、新型半导体集成电路及CMOS异质集成

2、电源管理及模拟集成电路设计

一、同行评审论文（一作/通讯）

(10) H. Qiu*, X. Zhang, J. Chen, M. Takamiya, Y. Shi, “A 6.78-MHz coupling coefficient sensorless wireless power transfer system charging multiple receivers with efficiency maximization by adaptive magnetic field distributor IC,” IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 71, no. 2, pp. 974-983, Feb. 2024.

(9) D. Fan, W. Li, H. Qiu*, Y. Xu, S. Gao, L. Liu, T. Li, F. Huang, Y. Mao, W. Zhou, W. Meng, M. Liu, X. Tu, P. Wang, Z. Yu, Y. Shi, X. Wang*, “Two-dimensional semiconductor integrated circuits operating at gigahertz frequencies,” Nature Electronics, vol. 6, no. 11, pp. 879-887, Nov. 2023.

(8) H. Qiu*, T. Sakurai, M. Takamiya*, “A 6.78-MHz multiple-transmitter wireless power transfer system with efficiency maximization by adaptive magnetic field adder IC,” IEEE Journal of Solid-State Circuits, vol. 57, pp. 2390–2403, Jun. 2022.（集成电路顶级期刊）

(7) H. Qiu*, Y. Jiang, Y. Shi*, T. Sakurai, M. Takamiya*, “Analysis and mitigation of coupling-dependent data flipping in wireless power and data transfer system,” IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 68, pp. 5182–5193, Dec. 2021.

(6) Y. Xu, W. Li, D. Fan, Y. Shi, H. Qiu*, X. Wang*, “A compact model for transition metal dichalcogenide field effect transistors with effects of interface traps,” Science China: Information Sciences, vol. 64, pp. 140408(1)–140408(3), Mar. 2021.

(5) H. Qiu*, T. Sakurai, M. Takamiya, “Digital transmitter coil for wireless power transfer robust against variation of distance and lateral misalignment,” IEEE Transactions on Microwave Theory and Techniques, vol. 68, pp. 4031–4039, May 2020.

(4) Y. Uno, H. Qiu*, T. Sai, S. Iguchi, Y. Mizutani, Y. Kawahara, Y. Kakehi, M. Takamiya*, “Luciola: a millimeter-scale light-emitting particle moving in mid-air based on acoustic levitation and wireless powering”, The Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies, vol. 1, pp. 166(1)–166(17), Dec. 2017.

(3) H. Qiu*, K. Takeuchi, T. Mizutani, Y. Yamamoto, H. Makiyama, T. Yamashita, H. Oda, S. Kamohara, N. Sugii, T. Saraya, M. Kobayashi, T. Hiramoto*, “Statistical write stability characterization in SRAM cells at low supply voltage,” IEEE Transactions on Electron Devices, vol. 63, pp. 4302–4308, Nov. 2016.

(2) H. Qiu, T. Xu, Z. Wang, W. Ren, H. Nan, Z. Ni, Q. Chen, S. Yuan, F. Miao, F. Song, G. Long, Y. Shi, L. Sun, J. Wang*, X. Wang*, “Hopping transport through defect-induced localized states in molybdenum disulphide,” Nature Communications, vol. 4, pp. 2642(1)–2642(6), Oct. 2013.（ESI高被引论文）

(1) H. Qiu, L. Pan, Z. Yao, J. Li, Y. Shi*, X. Wang*, “Electrical characterization of back-gated bi-layer MoS2 field-effect transistors and the effect of ambient on their performances”, Applied Physics Letters, vol. 100, pp. 123104–123106, Mar. 2012.（ESI高被引论文，APL年度引用冠军）

二、同行评审国际会议（一作/通讯）

(9) Q. Zhuang, J. Sun, X. Zhang, B. Li, Y. Shi, H. Qiu*, A 6.78 MHz wireless power and data transfer system achieving simultaneous 52.6 % end-to-end efficiency and 4.0 Mb/s forward data delivery with interference-free rectifier, in IEEE Symposium on VLSI Circuits, Hawaii, USA, Jun. 2024.（集成电路顶级国际会议）

(8) H. Qiu*, X. Zhang, J. Chen, M. Takamiya, Y. Shi, “Transmitter IC enabling magnetic field shaping for high-efficiency wireless charging of multiple receivers,” in IEEE International Conference on ASIC (ASICON), Nanjing, China, Oct. 2023.（邀请报告）

(7) W. Li, D. Fan, L. Shao, F. Huang, L. Liang, T. Li, Y. Xu, X. Tu, P. Wang, Z. Yu, Y. Shi, H. Qiu*, X. Wang*, “High-performance CVD MoS2 transistors with self-aligned top-gate and Bi contact,” in IEEE International Electron Devices Meeting (IEDM), Washington, USA, Dec. 2021.

(6) H. Qiu*, M. Takamiya, “A 6.78 MHz wireless power transfer system for simultaneous charging of multiple receivers with maximum efficiency using adaptive magnetic field distributor IC,” in IEEE Symposium on VLSI Circuits, Kyoto, Japan, Jun. 2021.（集成电路顶级国际会议）

(5) H. Qiu*, T. Sai, M. Takamiya, “A 6.78 MHz wireless power transfer system enabling perpendicular wireless powering with efficiency increase from 0.02 % to 48.2 % by adaptive magnetic field adder IC integrating shared coupling coefficient sensor,” in IEEE Symposium on VLSI Circuits, Hawaii, USA, Jun. 2020.（集成电路顶级国际会议）

(4) H. Qiu*, T. Sakurai, M. Takamiya, “Coupling-dependent data flipping in wireless power and data transfer system,” in IEEE International Symposium on Circuits and Systems (ISCAS), Sapporo, Japan, May 2019.

(3) H. Qiu*, K. Takeuchi, T. Mizutani, T. Saraya, J. Chen, M. Kobayashi, T. Hiramoto, “Statistical analyses of random telegraph noise amplitude in ultra-narrow (deep sub-10nm) silicon nanowire transistors,” in IEEE Symposium on VLSI Technology, Kyoto, Japan, Jun. 2017.（集成电路顶级国际会议）

(2) H. Qiu*, T. Mizutani, Y. Yamamoto, H. Makiyama, T. Yamashita, H. Oda, S. Kamohara, N. Sugii, T. Saraya, M. Kobayashi, T. Hiramoto, “Impact of random telegraph noise on write stability in silicon-on-thin-BOX (SOTB) SRAM cells at low supply voltage in sub-0.4V regime,” in IEEE Symposium on VLSI Technology, Kyoto, Japan, Jun. 2015.（集成电路顶级国际会议）

(1) H. Qiu*, T. Mizutani, Y. Yamamoto, H. Makiyama, T. Yamashita, H. Oda, S. Kamohara, N. Sugii, T. Saraya, M. Kobayashi, T. Hiramoto, “Statistical analysis of four write stability metrics in fully depleted silicon-on-thin-BOX (SOTB) and bulk SRAM cells at low supply voltage,” in IEEE International Conference on Solid-State Integrated Circuit Technology (ICSICT), Guilin, China, Oct. 2014.（优秀学生论文奖）